PATLY.AIApplication
19668202 · Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated Fan-Out Package with Integrated Passive Device
Filed 2026-05-05 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 90/00 · Taiwan Semiconductor Manufacturing Co., Ltd. · SLATER MATSIL, LLP/TSMC
Office actions
0
first was
RCEs
0
no appeal
To first action
n/a
to disposition n/a
Statutes raised
·
0 actions read