Application

19687588 · HEAT-SINK-COUPLED CONDUCTOR STRUCTURES WITH INTEGRATED CURRENT SENSORS AND EDDY CURRENT MITIGATION

Filed 2026-05-26 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H02M 1/0009 · Allegro MicroSystems, LLC · DALY, CROWLEY, MOFFORD & DURKEE, LLP

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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