Application
19688248 · THREE-DIMENSIONAL (3D) NAND COMPONENT WITH CONTROL CIRCUITRY ACROSS MULTIPLE WAFERS
Filed 2026-05-26 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 90/00 · Intel NDTM US LLC · Morgan, Lewis & Bockius LLP (SV - Solidigm)
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