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19699455 · MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS

Filed 2026-06-05 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 74/117 · Intel Foundry IP LLC · SCHWABE, WILLIAMSON & WYATT, P.C.

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