PATLY.AIApplication
19700555 · SEMICONDUCTOR ASSEMBLY INCLUDING A SEMICONDUCTOR PACKAGE WITH A DELAMINATION MITIGATION FEATURE
Filed 2026-06-08 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 74/016 · Infineon Technologies Austria AG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES
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