Application

19700580 · POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN

Filed 2026-06-08 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 90/701 · SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · onsemi (BHB)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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