Application

19701754 · FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD for manufacturing SAME

Filed 2026-06-09 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 74/121 · SJ Semiconductor(Jiangyin) Corporation · IPRTOP LLC

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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