PATLY.AIApplication
19704777 · Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly
Filed 2026-06-11 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 40/70 · Taiwan Semiconductor Manufacturing Company, Ltd. · Haynes and Boone, LLP (24061)
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