Application

19705976 · METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Filed 2026-06-12 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 70/424 · Zhuhai ACCESS Semiconductor Co., Ltd · The PL Law Group, PLLC

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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