Application

19708577 · REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARPAGE REDUCTION

Filed 2026-06-15 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10P 76/4085 · Taiwan Semiconductor Manufacturing Company, Ltd. · Haynes and Boone, LLP (24061)

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

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