Application

19713555 · Semiconductor Device and Method of Forming Channels in Encapsulant to Reduce Warpage in Reconstituted Wafer

Filed 2026-06-18 · Pending The official file ↗ · Art unit OPAP · Examiner Docket Central Easy · CPC H10W 74/10 · STATS ChipPAC Pte. Ltd. · STATS ChipPAC/PATENT LAW GROUP:

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

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