Application

19880290 · ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, DICING DIE-BONDING INTEGRATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Filed 2026-09-29 · Pending The official file ↗ · Art unit · WENDEROTH, LIND & PONACK, L.L.P.

Office actions

first was

RCEs

no appeal

To first action

n/a

to disposition n/a

Statutes raised

0 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.