Company or institution

NAMICS CORPORATION

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144 applicationsfiled 2008 to 2025

Allowance rate

65%

−11 pts vs the USPTO range 56% to 73%

Rejections before allowance

1.8

+0.2 vs the USPTO

Months to first action

18.8 mo

+0.2 vs the USPTO

Needed an RCE

34%

+6 pts vs the USPTO

Timeline

Applications by filing year: drag across the years to study a period

Allowed in green, abandoned in red, pending in grey. The figures above and the charts that can be recomputed by filing year follow the span you pick.

Compared with the office

Against every applicant before the USPTO

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Trend

Allowance by filing year

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Domains

Where the applications fall

CPC subclasses

H10W 23 apps

C08F 16 apps

C08G 16 apps

H10F 13 apps

H01M Batteries and fuel cells12 apps

C08K 10 apps

Art units

176120 apps

176715 apps

176612 apps

17659 apps

17647 apps

OPAP6 apps

Examiners met

The examiners seen most, and how it went with each

Michael J Feely6 apps

83%

Khanh Tuan Nguyen6 apps

83%

Docket Central5 apps

n/a

Ha S Nguyen4 apps

75%

William D Young4 apps

50%

David Thomas Karst4 apps

50%

Jessica Marie Roswell3 apps

Robert E Sellers3 apps

33%

Bars show the share of decided applications that were allowed.

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Who represents them

Law firms and agents on their applications

HOLTZ, HOLTZ & VOLEK PC63 apps

58%

Rankin, Hill & Clark LLP35 apps

71%

HSML P.C.7 apps

57%

Clark+Elbing LLP6 apps

80%

HARNESS DICKEY (DETROIT)5 apps

100%

Muncy, Geissler, Olds & Lowe, P.C.4 apps

100%

Jordan and Koda, PLLC3 apps

67%

NIXON & VANDERHYE, PC3 apps

33%

Bars show the share of decided applications that were allowed.

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Rejection fingerprint

What gets rejected, by statute

Share of parsed office actions raising each ground; blue is the USPTO.

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What works

Allowance by strategy used

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Interviews

Does an interview help?

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Applications

Every application in the record

Application	Title	Filed	Status	Rejections	RCEs	To 1st action
19628870	POLYMERIZABLE COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR…	2026-09-28	Pending	0	0	n/a
19628902	CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVIC…	2026-09-28	Pending	0	0	n/a
19627512	RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE,…	2026-09-24	Pending	0	0	n/a
15780589	Method and apparatus for adaptive signal processing	2012-01-10	Allowed	1	0	12.0 mo
15219319	Composition and method for controlled release	2015-02-11	Abandoned	4	1	23.0 mo
15372216	Distributed ledger transaction verification	2018-03-12	Allowed	3	0	20.0 mo
15825715	Thermal management of battery assemblies	2021-04-13	Pending	2	1	17.0 mo
15603244	Machine learning model for anomaly detection	2012-05-14	Allowed	1	0	14.0 mo
15760804	Wireless power transfer coil arrangement	2015-06-15	Abandoned	4	1	25.0 mo
15533051	Catalyst for selective hydrogenation	2018-07-16	Allowed	3	0	22.0 mo

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