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Topic

Forming integrated circuit Steady

203 applications whose title mentions it. Its share of new filings over the last two years is -16% below the four years before.

Allowance rate
88%
+12 pts vs the USPTO 192 decided
Months to first action
15.2 mo
−3.4 vs the USPTO
Applications
203.0
in the record
Allowed
168.0
24 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19513175INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME2026-02-23Pending00n/a
19501665INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME2026-01-13Pending00n/a
17134101METHOD OF FORMING A CONTACT PLUG IN A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE2020-12-24Allowed1015.0 mo
15818103Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15316752Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15908067Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15412715Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15123261Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15433378Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15516853Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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