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Topic

Integrated circuit die Steady

205 applications whose title mentions it. Its share of new filings over the last two years is 7% above the four years before.

Allowance rate
88%
+13 pts vs the USPTO 176 decided
Months to first action
17.9 mo
−0.7 vs the USPTO
Applications
205.0
in the record
Allowed
155.0
21 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19647088INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR2026-04-14Pending00n/a
19552593SEMICONDUCTOR PACKAGE INCLUDING AN INTEGRATED CIRCUIT DIE AND AN INDUCTOR OR A TRAN…2026-02-27Pending00n/a
19420890DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUCTOR DIE2025-12-16Pending00n/a
15676851Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15626874Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15491715Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15114670Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15931027Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15950282Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15874151Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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