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Topic

Semiconductor component Steady

1,137 applications whose title mentions it. Its share of new filings over the last two years is -4% below the four years before.

Allowance rate
84%
+8 pts vs the USPTO 1,033 decided
Months to first action
17.3 mo
−1.3 vs the USPTO
Applications
1,137.0
in the record
Allowed
866.0
167 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19628870POLYMERIZABLE COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR…2026-09-28Pending00n/a
19628902CURABLE RESIN COMPOSITION, ADHESIVE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVIC…2026-09-28Pending00n/a
19627512RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE,…2026-09-24Pending00n/a
15996759Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15427910Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15160512Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15642818Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15541544Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15972963Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15457935Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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