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Topic

Semiconductor package forming Steady

242 applications whose title mentions it. Its share of new filings over the last two years is 153% above the four years before.

Allowance rate
89%
+13 pts vs the USPTO 149 decided
Months to first action
17.1 mo
−1.5 vs the USPTO
Applications
242.0
in the record
Allowed
132.0
17 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19264348SEMICONDUCTOR PACKAGE WITH THERMAL CONDUCTIVE STRUCTURE AND THE METHODS OF FORMING …2025-07-09Pending00n/a
19258019PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME2025-07-02Pending00n/a
19256352PHOTONIC SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME2025-07-01Pending00n/a
15352052Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15193673Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15113789Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15914833Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15567322Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15838299Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15587031Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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