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Topic

Substrate semiconductor package Steady

299 applications whose title mentions it. Its share of new filings over the last two years is 112% above the four years before.

Allowance rate
85%
+9 pts vs the USPTO 237 decided
Months to first action
16.7 mo
−1.9 vs the USPTO
Applications
299.0
in the record
Allowed
201.0
36 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19617488SUPPORTING GLASS SUBSTRATE, LAMINATE, MANUFACTURING METHOD OF LAMINATE AND MANUFACT…2026-08-21Pending00n/a
19585684RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, AND DRY FILM, OPTICAL WAVEGUIDE, AND SEMIC…2026-05-07Pending00n/a
19528117THROUGH ELECTRODE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFACTURING T…2026-04-13Pending00n/a
15996274Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15947944Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15967178Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15541761Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15905827Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15283055Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15381170Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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