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Topic

Wafer bonding Steady

391 applications whose title mentions it. Its share of new filings over the last two years is 37% above the four years before.

Allowance rate
85%
+9 pts vs the USPTO 318 decided
Months to first action
17.6 mo
−1.0 vs the USPTO
Applications
391.0
in the record
Allowed
269.0
49 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19621259COMPOSITION, COMPOSITION FOR TEMPORARY BONDING, AND METHOD OF MANUFACTURING WAFER U…2026-09-03Pending00n/a
19511961WAFER HOLDING DEVICE, BONDING DEVICE, WAFER HOLDING METHOD, AND BONDING METHOD2026-02-17Pending00n/a
19505772PROCESS CONTROL TECHNIQUES FOR WAFER-TO-WAFER BONDING2026-01-27Pending00n/a
15114804Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15830880Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15494764Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15274963Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15296466Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15736970Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15353772Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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