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Topic

Bonding Steady

9,087 applications whose title mentions it. Its share of new filings over the last two years is 4% above the four years before.

Allowance rate
78%
+2 pts vs the USPTO 7,912 decided
Months to first action
18.4 mo
−0.2 vs the USPTO
Applications
9,087.0
in the record
Allowed
6,157.0
1,755 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19880290ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, DICING DIE-BONDING …2026-09-29Pending00n/a
19628987BONDING MATERIAL FOR HEAT-DISSIPATING SUBSTRATE, METHOD FOR MANUFACTURING HEAT-DISS…2026-09-28Pending00n/a
19880182METAL PASTE FOR BONDING, BONDED BODY, AND MANUFACTURING METHOD FOR BONDED BODY2026-09-28Pending00n/a
15592907Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15994704Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15606719Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15307614Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15892609Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15122107Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15897146Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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