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Topic

Die Steady

8,877 applications whose title mentions it. Its share of new filings over the last two years is 9% above the four years before.

Allowance rate
82%
+7 pts vs the USPTO 7,694 decided
Months to first action
17.8 mo
−0.8 vs the USPTO
Applications
8,877.0
in the record
Allowed
6,327.0
1,367 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19880290ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, DICING DIE-BONDING …2026-09-29Pending00n/a
19626219DIE OUTLINE DESIGN STRATEGY FOR AUGMENTED REALITY LIGHTGUIDE COMBINERS2026-09-21Pending00n/a
19624851SYSTEM AND METHOD FOR DIE BONDING WITH DIFFRACTION BASED ALIGNMENT MARKS ON THE DIE2026-09-16Pending00n/a
15637928Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15655361Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15594380Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15625745Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15380710Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15196481Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15748088Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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