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Topic

Semiconductor chip package Steady

196 applications whose title mentions it. Its share of new filings over the last two years is -2% below the four years before.

Allowance rate
74%
−2 pts vs the USPTO 185 decided
Months to first action
17.5 mo
−1.1 vs the USPTO
Applications
196.0
in the record
Allowed
136.0
49 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19594439DEVICE PACKAGE WITH A HYBRID SEMICONDUCTOR CHIP2026-06-08Pending00n/a
19484283INTEGRATED COMPONENT PACKAGE WITH A LASER PACKAGE ARRANGED ON A SEMICONDUCTOR CHIP2025-11-13Pending00n/a
16951511Multi-Chip Semiconductor Package2020-11-18Allowed2112.5 mo
15174635Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15425246Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15602384Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15784474Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15345879Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15238132Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15304831Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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