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Topic

Semiconductor die Steady

1,379 applications whose title mentions it. Its share of new filings over the last two years is 9% above the four years before.

Allowance rate
90%
+15 pts vs the USPTO 1,167 decided
Months to first action
15.9 mo
−2.7 vs the USPTO
Applications
1,379.0
in the record
Allowed
1,054.0
113 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19880290ADHESIVE FILM FOR SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, DICING DIE-BONDING …2026-09-29Pending00n/a
19624300THERMOSETTING RESIN FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND…2026-09-15Pending00n/a
19597747PROVIDING AN ENVIRONMENTAL ACCESS/SAMPLING PORT TO A SEMICONDUCTOR DIE2026-06-16Pending00n/a
15378174Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15818377Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15128227Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15476441Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15765680Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15958054Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15103972Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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