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Topic

Circuit fabrication Steady

360 applications whose title mentions it. Its share of new filings over the last two years is -13% below the four years before.

Allowance rate
87%
+12 pts vs the USPTO 310 decided
Months to first action
17.1 mo
−1.5 vs the USPTO
Applications
360.0
in the record
Allowed
270.0
40 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19605434HIGH-PERFORMANCE, LOW SIGNAL LOSS, HIGH-DENSITY, MULTI-LAYER, DOUBLE-SIDED 3D PRINT…2026-07-10Pending00n/a
17133080METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUI…2020-12-23Abandoned4135.9 mo
17131701DIELECTRIC CAPACITANCE RECOVERY OF INTER-LAYER DIELECTRIC LAYERS FOR ADVANCED INTEG…2020-12-22Allowed2135.3 mo
15710862Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15754480Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15803186Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15674017Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15234649Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15988345Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15840759Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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