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Topic

Circuit packaging Steady

473 applications whose title mentions it. Its share of new filings over the last two years is -7% below the four years before.

Allowance rate
90%
+14 pts vs the USPTO 453 decided
Months to first action
17.2 mo
−1.4 vs the USPTO
Applications
473.0
in the record
Allowed
407.0
46 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19522823INTEGRATED CIRCUIT PACKAGES AND PACKAGING SUBSTRATES AND METHODS FOR MANUFACTURING …2026-03-25Pending00n/a
17056188METHOD OF ADDITIVELY MANUFACTURING AN INTEGRATED CIRCUIT OF AN INTERCONNECT PACKAGI…2020-11-17Allowed1033.8 mo
17070763PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS2020-10-14Allowed1010.3 mo
15683865Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15669686Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15876860Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15401621Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15651360Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15502817Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15752508Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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