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Topic

Integrated circuit packaging Steady

461 applications whose title mentions it. Its share of new filings over the last two years is -12% below the four years before.

Allowance rate
90%
+14 pts vs the USPTO 443 decided
Months to first action
17.2 mo
−1.4 vs the USPTO
Applications
461.0
in the record
Allowed
398.0
45 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19522823INTEGRATED CIRCUIT PACKAGES AND PACKAGING SUBSTRATES AND METHODS FOR MANUFACTURING …2026-03-25Pending00n/a
17056188METHOD OF ADDITIVELY MANUFACTURING AN INTEGRATED CIRCUIT OF AN INTERCONNECT PACKAGI…2020-11-17Allowed1033.8 mo
17007454SYSTEMS AND METHODS FOR PACKAGING AN ACOUSTIC DEVICE IN AN INTEGRATED CIRCUIT (IC)2020-08-31Allowed1033.4 mo
15602349Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15300614Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15893906Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15504531Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15338691Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15129520Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15497926Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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