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Topic

Redistribution layer Steady

393 applications whose title mentions it. Its share of new filings over the last two years is -24% below the four years before.

Allowance rate
89%
+13 pts vs the USPTO 339 decided
Months to first action
15.8 mo
−2.8 vs the USPTO
Applications
393.0
in the record
Allowed
301.0
38 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19608843REDISTRIBUTION LAYER (RDL) FANOUT PACKAGE DESIGN & CHIPLET DIE-TO-DIE INTERCONNECT …2026-07-23Pending00n/a
19708577REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARPAGE REDUCTION2026-06-15Pending00n/a
19668202Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated F…2026-05-05Pending00n/a
15712302Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15992447Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15279299Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15237680Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15361451Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15654007Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15791153Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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