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Topic

Wafer level package Steady

296 applications whose title mentions it. Its share of new filings over the last two years is -29% below the four years before.

Allowance rate
80%
+5 pts vs the USPTO 291 decided
Months to first action
14.0 mo
−4.6 vs the USPTO
Applications
296.0
in the record
Allowed
233.0
58 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
17134756OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPABILITY2020-12-28Pending528.4 mo
17115093WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER2020-12-08Allowed1024.5 mo
17110035WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER2020-12-02Allowed1022.5 mo
15554315Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15324406Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15373491Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15808465Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15210675Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15202497Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15847922Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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