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Topic

Wafer level packaging Steady

187 applications whose title mentions it. Its share of new filings over the last two years is 18% above the four years before.

Allowance rate
80%
+5 pts vs the USPTO 176 decided
Months to first action
13.5 mo
−5.1 vs the USPTO
Applications
187.0
in the record
Allowed
141.0
35 abandoned

Filings by year

How often the topic was filed

The most recent years are still filling in.

Applications

Recent applications on this topic

ApplicationTitleFiledStatusRejectionsRCEsTo 1st action
19701754FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD for manufacturing SAME2026-06-09Pending00n/a
19583565Wafer-Level Ultra-Thin Quad Flat No-Lead Chip Packaging Method and Chip Packaging S…2026-04-30Pending00n/a
19654046WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR2026-04-21Pending00n/a
15890685Method and apparatus for adaptive signal processing2012-01-10Allowed1012.0 mo
15792521Composition and method for controlled release2015-02-11Abandoned4123.0 mo
15943285Distributed ledger transaction verification2018-03-12Allowed3020.0 mo
15219576Thermal management of battery assemblies2021-04-13Pending2117.0 mo
15155224Machine learning model for anomaly detection2012-05-14Allowed1014.0 mo
15491310Wireless power transfer coil arrangement2015-06-15Abandoned4125.0 mo
15446221Catalyst for selective hydrogenation2018-07-16Allowed3022.0 mo
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