Where it is examined
Topic
Wafer level packaging Steady
187 applications whose title mentions it. Its share of new filings over the last two years is 18% above the four years before.
Allowance rate
80%
+5 pts vs the USPTO 176 decided
Months to first action
13.5 mo
−5.1 vs the USPTO
Applications
187.0
in the record
Allowed
141.0
35 abandoned
Filings by year
How often the topic was filed
The most recent years are still filling in.
Examiners
Who examines it, and how it fares with each
Bars show the share of decided applications that were allowed.
Who files it
Companies and institutions
Bars show the share of decided applications that were allowed.
Who represents them
Law firms and agents
Bars show the share of decided applications that were allowed.
Applications
Recent applications on this topic
| Application | Title | Filed | Status | Rejections | RCEs | To 1st action |
|---|---|---|---|---|---|---|
| 19701754 | FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD for manufacturing SAME | 2026-06-09 | Pending | 0 | 0 | n/a |
| 19583565 | Wafer-Level Ultra-Thin Quad Flat No-Lead Chip Packaging Method and Chip Packaging S… | 2026-04-30 | Pending | 0 | 0 | n/a |
| 19654046 | WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR | 2026-04-21 | Pending | 0 | 0 | n/a |
| 15890685 | Method and apparatus for adaptive signal processing | 2012-01-10 | Allowed | 1 | 0 | 12.0 mo |
| 15792521 | Composition and method for controlled release | 2015-02-11 | Abandoned | 4 | 1 | 23.0 mo |
| 15943285 | Distributed ledger transaction verification | 2018-03-12 | Allowed | 3 | 0 | 20.0 mo |
| 15219576 | Thermal management of battery assemblies | 2021-04-13 | Pending | 2 | 1 | 17.0 mo |
| 15155224 | Machine learning model for anomaly detection | 2012-05-14 | Allowed | 1 | 0 | 14.0 mo |
| 15491310 | Wireless power transfer coil arrangement | 2015-06-15 | Abandoned | 4 | 1 | 25.0 mo |
| 15446221 | Catalyst for selective hydrogenation | 2018-07-16 | Allowed | 3 | 0 | 22.0 mo |